Three-dimensional dam 3535 type ceramic substrate
Three-dimensional dam 3535 type ceramic substrate
Three-dimensional dam 3535 type ceramic substrate
- Detail
- Parameters
Such three-dimensional dam type ceramic substrate is admired by advantages of low thermo-mismatch (between substrate and dam),
flexible dam height, flat electrode surface, as well as reliable air tightness. It is naturally suitable for achieving flip chip welding of UVC-LED,
and it is used in UV-LED curing and sterilization fields.
Item | Unit | Min. | Typ. | Max. |
Thermo-conductivity | W/m*K | 160 | 65 | 80 |
Thickness (conducting layer) | um | 50 | 65 | 80 |
Size (single) | mm | / | 3.5×3.5×1.14 | / |
Size (integrated) | mm | / | 109.2×54.5×1.14 | / |
Line width (Minimal) | um | 100 | / | / |
Surface treatment | NiAu/NiPdAu (Customizable) | |||
Dam Material | Ceramic (achieve by inorganically pressure) | |||
